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Surface functionalisation lab

The laboratory was equipped with two types of thin film and coating equipment:

  • Atomic Layer Deposition (ALD)
  • Physical Vapour Deposition (PVD)

Atomic Layer Deposition (ALD)

Physical Vapour Deposition (PVD)

Lab supervisor

Marcin Basiaga, PhD, Eng.

Marcin.Basiaga@polsl.pl
room 109, Zabrze

Atomic Layer Deposition (ALD)

Beneq TFS200 – Single atomic layer deposition system

  • the device allows thin layers to be created at temperatures of up to 500°C
  • the process takes place in a nitrogen atmosphere 5.0 
  • internal dimensions of the chamber: diameter 200mm, height 90mm
  • we have a wide range of precursors, such as: zinc, tin, aluminium, titanium, zirconium, tantalum
  • the layer can consist of either one of the precursors, several, or their oxides
  • it is possible to control both the quantity and duration of individual cycles

Beneq TFS200 parameters:

  • 2 chambers 200 mm x 95 mm
  • 1 chamber 200 mm x 18 mm
  • 4 liquid sources
  • 2 heated sources
  • 2 gas lines
  • O3 delivery system
  • Nanoparticle coating module
  • Excellent adhesion – chemisorption
  • Sequentiality
  • Repeatability,
  • High throughput,
  • Low process temperature,
  • Controlled thickness

Physical Vapour Deposition (PVD)

Physical Vapour Deposition (PVD) system equipped with a magnetron sputtering module.

  • The base pressure in the chamber is 5×10-7 mbar – UHV (Ultra High Vacuum) standard.
  • Possibility to install up to 3 magnetron guns and two types of DC and RF power supply, together with a co-deposition module and gas lines for nitrogen and oxygen.
  • Chamber, showing magnetron sputtering source in operation

Moorfield’s device, the nanoPVD-S10A, is a magnetron sputtering system for sputtering metals or insulating materials such as oxides and nitrides. The units are equipped with turbomolecular pumping systems to ensure low contamination operation. Co-deposition is possible, as well as reactive sputtering using a gas/pressure control module that can handle up to three process gases. The system works with classic industrial targets (e.g. TiN, TiO2, C) and substrates up to 4″ in size.

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