The laboratory is equipped with two types of ultra-thin film and coating equipment:
- Atomic Layer Deposition (ALD)
- Physical Vapour Deposition (PVD)
Atomic Layer Deposition (ALD)
Physical Vapour Deposition (PVD)
Atomic Layer Deposition (ALD)
Beneq TFS200 – Single atomic layer deposition system
- the system is capable of producing thin films at temperatures of up to 500°C
- the process takes place in a nitrogen atmosphere of 5.0 mbar
- internal chamber dimensions: diameter 200mm, height 90mm
- we have a wide range of precursors, such as: zinc, tin, aluminium, titanium, zirconium, tantalum
- the layer can consist of one or more of the precursors or their oxides
- it is possible to control both the quantity and the duration of each cycle
Beneq TFS200 parameters:
- 2 chambers 200 mm x 95 mm
- 1 chamber 200 mm x 18 mm
- 4 liquid sources
- 2 heated sources
- 2 gas lines
- O3 delivery system
- Nanoparticle coating module
- Excellent adhesion – chemisorption
- Sequentiality
- Repeatability,
- High throughput,
- Low process temperature,
- Controlled thickness
Physical Vapour Deposition (PVD)
Physical Vapour Deposition (PVD) system equipped with a magnetron sputtering module.
- The basic pressure in the chamber is 5×10-7 mbar – UHV (Ultra High Vacuum) standard.
- Possibility to install up to 3 magnetron guns and two types of DC and RF power supply, together with a co-deposition module and gas lines for nitrogen and oxygen.
- Chamber, showing magnetron sputtering source in operation
Moorfield’s system, the nanoPVD-S10A, is a magnetron sputtering system for sputtering metals or insulating materials such as oxides and nitrides. The systems are equipped with turbomolecular pumping systems to ensure low contamination operation. Co-deposition is possible, as well as reactive sputtering using a gas/pressure control module that can handle up to three process gases. The system works with classic industrial targets (e.g. TiN, TiO2, C) and substrates up to 4″ in size.
