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Surface Functionalization Lab

The laboratory is equipped with two types of ultra-thin film and coating equipment:

  • Atomic Layer Deposition (ALD)
  • Physical Vapour Deposition (PVD)

Atomic Layer Deposition (ALD)

Physical Vapour Deposition (PVD)

Lab supervisor

Anna Taratuta, PhD, Eng.

Atomic Layer Deposition (ALD)

Beneq TFS200 – Single atomic layer deposition system

  • the system is capable of producing thin films at temperatures of up to 500°C
  • the process takes place in a nitrogen atmosphere of 5.0 mbar 
  • internal chamber dimensions: diameter 200mm, height 90mm
  • we have a wide range of precursors, such as: zinc, tin, aluminium, titanium, zirconium, tantalum
  • the layer can consist of one or more of the precursors or their oxides
  • it is possible to control both the quantity and the duration of each cycle

Beneq TFS200 parameters:

  • 2 chambers 200 mm x 95 mm
  • 1 chamber 200 mm x 18 mm
  • 4 liquid sources
  • 2 heated sources
  • 2 gas lines
  • O3 delivery system
  • Nanoparticle coating module
  • Excellent adhesion – chemisorption
  • Sequentiality
  • Repeatability,
  • High throughput,
  • Low process temperature,
  • Controlled thickness

Physical Vapour Deposition (PVD)

Physical Vapour Deposition (PVD) system equipped with a magnetron sputtering module.

  • The basic pressure in the chamber is 5×10-7 mbar – UHV (Ultra High Vacuum) standard.
  • Possibility to install up to 3 magnetron guns and two types of DC and RF power supply, together with a co-deposition module and gas lines for nitrogen and oxygen.
  • Chamber, showing magnetron sputtering source in operation

Moorfield’s system, the nanoPVD-S10A, is a magnetron sputtering system for sputtering metals or insulating materials such as oxides and nitrides. The systems are equipped with turbomolecular pumping systems to ensure low contamination operation. Co-deposition is possible, as well as reactive sputtering using a gas/pressure control module that can handle up to three process gases. The system works with classic industrial targets (e.g. TiN, TiO2, C) and substrates up to 4″ in size.

Silesian Center for Engineering Support
in Medicine and Sport "Assist Med. Sport Silesia"

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